In recent years, LED lighting has rapidly evolved, and one of the most innovative advancements is COB technology — short for Chip-on-Board. But what exactly are COB LEDs, and why are they important in today’s lighting world?What Are COB LEDs?COB (Chip-on-Board) LEDs are a type of LED technology where multiple LED chips are packaged directly onto a single circuit board. Unlike traditional LED designs (like SMD), where each chip functions independently, COB p

1. Light AppearanceCOB: Seamless, dot-free continuous light — great for aesthetic and close-up lighting.SMD: Visible LED dots unless diffused — may look uneven in some setups.2. BrightnessCOB: Softer light with moderate brightness.SMD: Higher peak brightness — better for task or outdoor lighting.3. FlexibilityCOB: More bendable and compact — ideal for curves or tight spaces.SMD: Less flexible, especially with high-power versions.4. Heat and EfficiencyCOB:&nb

Chip-on-Board (COB) lighting technology has revolutionized the world of LEDs by providing superior light quality, enhanced efficiency, and a wide array of applications. As the demand for energy-efficient and sustainable lighting solutions grows, COB technology stands out as a leader in modern lighting systems. However, like any technology, COB lighting has its strengths and limitations. This article explores both aspects to offer a comprehensive understanding of COB lighting.What is COB Lighting

COB stands for Chip on Board, a cutting-edge packaging technology that directly mounts multiple LED chips onto a substrate (e.g., circuit board) to form a high-density integrated light source. This contrasts with traditional methods like SMD (Surface-Mounted Device) or DIP (Dual In-line Package).1. Technical PrincipleIntegration: Multiple bare LED chips are bonded onto a substrate using conductive/non-conductive adhesives, then interconnected via wire bonding[1].Encapsulation: A p

COB (Chip on Board) is an advanced LED packaging technology that directly integrates multiple LED chips onto a high-reflectivity substrate, eliminating traditional processes like soldering and surface mountingWorking PrincipleHigh-Density Packaging: COB arranges LED chips tightly on a single substrate, reducing gaps between light sources and achieving uniform illumination without visible spotsThermal Management: The integrated substrate design enhances heat dissipation, reducing thermal resistan