COB (Chip on Board) is an advanced LED packaging technology that directly integrates multiple LED chips onto a high-reflectivity substrate, eliminating traditional processes like soldering and surface mounting

Working Principle

High-Density Packaging: COB arranges LED chips tightly on a single substrate, reducing gaps between light sources and achieving uniform illumination without visible spots

Thermal Management: The integrated substrate design enhances heat dissipation, reducing thermal resistance and extending lifespan by minimizing chip degradation

Key Advantages

Higher Efficiency: COB LEDs increase brightness by ≈33% while reducing energy consumption by ≈40% compared to traditional SMD LEDs

Uniform Light: Eliminates "spotty" light effects common in SMDs, providing seamless illumination

Durability: Industrial applications (e.g., displays) achieve 99% automation rates, ensuring high production precision and reliability

Applications

Widely used in high-end lighting, mini/micro-LED displays (P0.6–P2.5), and energy-efficient solutions like transparent/flexible screens